Matvienko, M., V. Kvasnitsky, and D. Golub. “The Effect of Plastic Creep Deformations of the Interlayer During the TLP-Bonding of High-Temperature Alloys on the Formation of the Stress-Strain State of the Nodes in the Cooling Process”. HERALD of the Donbass State Engineering Academy, no. 2 (46) (October 1, 2019): 22-28. Accessed April 25, 2024. http://herald.dgma.donetsk.ua/index.php/main/article/view/19.