Matvienko, M., Kvasnitsky, V., & Golub, D. (2019). The effect of plastic creep deformations of the interlayer during the TLP-bonding of high-temperature alloys on the formation of the stress-strain state of the nodes in the cooling process. HERALD of the Donbass State Engineering Academy, (2 (46), 22-28. https://doi.org/10.37142/1993-8222/2019-2(46)22